During the KPCA show 2016 (April 26 to 28, 2016), CFL will present its new development with ultraflat foils for low loss and high frequency applications and DoublethinTM foils for Laser Direct Drilling.

Our newly developed ultraflat copper foil (No profile) is the leading edge technology for the upcoming high speed digital-low loss market.
Discover also the new ultrathin carrier supported copper foils allowing ground breaking coreless designs for chip scale packaging.
For further details about the show:  http://www.kpcashow.com/eng/main.asp