Like every year now, Circuit Foil Luxembourg will be presenting its complete copper foil offering at the IPC APEX show in Las Vegas, NV from March 15 to 17, 2016.
Exciting new developments of ultraflat copper foils for high speed digital circuitry will be presented.

Our newly developed ultraflat copper foil (No profile) is the leading edge technology for the upcoming high speed digital-low loss market.
Discover also the new ultrathin carrier supported copper foils allowing ground breaking coreless designs for chip scale packaging.
Recently added ultrathin carrier supported copper foils will enable you to design circuits with lines and spacing well below 2mil.

Find out by yourself on our booth #609 ! We are looking forward to meeting you there.

For further details about the show: IPC APEX EXPO 2016