Like every year now, Circuit Foil Luxembourg will be presenting its complete copper foil offering at the IPC APEX show in San Diego, CA from February 14 to 16, 2017.
Exciting new developments of ultraflat copper foils for RF & high speed digital circuitry will be presented.

Our newly developed No Profile copper foil is the leading edge technology for the upcoming 5G RF and also high speed digital-low loss market.
Discover also the new ultrathin carrier supported copper foils allowing ground breaking coreless designs for chip scale packaging, enabling you to design circuits with lines and spacing below 1.25mil.

Find out by yourself on our booth #3900 ! We are looking forward to meeting you there.

For further details about the show: IPC APEX EXPO 2017