Like every year now, Circuit Foil Luxembourg will be presenting its complete copper foil offering at the IPC APEX show in San Diego, CA from February 27 to March 1, 2018.
Exciting new developments of ultraflat copper foils for RF & high speed digital circuitry will be presented.

Our newly developed No Profile copper foil is the leading edge technology for the upcoming 5G.

Circuit Foil will also display the new ultrathin carrier supported copper foils especially designed for IC Substrate and Substrate-Like PCB.

Please visit us at our booth  #501 ! We are looking forward to meeting you there.


For further details about the show: IPC APEX EXPO 2018