Foil Coatings Division

Foil Coatings division develops and produces resin-coated copper foils used mainly in High Density Interconnect printed circuit boards for high interconnection densities with microvia drillholes.

The state-of-the-art coating line with its accurate coating thickness control, combined with adjusted resin flow characteristics is suitable for a production of Resin-Coated Copper Foil with excellent hole filling properties and with a very high quality of microvia under the trade name of “Isofoil” and “Ecofoil”.

New product developments respectively further improvement of existing products are carried out to be ready for the market requirements of the next printed circuit board generation.