Fairs and exhibition

Circuit Foil was present at the HKPCA at the Shenzhen Convention & Exhibition Center in China on November 30 and December 1, 2011 and will also be present at the IPC Apex Expo to be held in San Diego from February 28 till March 1, 2012 (booth 1807) to present the latest status of new ED copper foils for Low Loss / High Speed PCBs and for IC-Packaging Applications.

Please refer to the abstract by Raymond Gales, Customer Care and Group Quality Director:
Newest ED-Copper Foils IPC San Diego 2012.pdf