Fairs and exhibition in 2012

Circuit Foil will show its newly developed copper foils for finest pitch applications, for low loss CCL as well as for chip embedding techniques :

at IPC in Las Vegas from February 28 till March 1 (booth 1807). A technical presentation will be held by Mr. Raymond Gales, Customer Care & Group Quality Director, on the topic of “Newest ED-copper foils for High Speed PCB’s and IC-Packaging Applications” on Tuesday February 29 from 1:30 – 3:30 p.m. (S24: Singal Integrity II);