CFL active membership in the HERMES project.

Circuit Foil Luxembourg active membership in the HERMES project

Circuit Foil Luxembourg is an active member of the HERMES consortium together with ten other European participants coming from 6 different member states of the European Union. HERMES (High Density Integration by Embedding Chips for Reduced Size Modules and Electronic Systems) is the first EU funded project in the frame of FP7 that enables an industrial consortium to develop a technology to the maturity level for industrialisation. The idea to bring the chip embedding technology in the European market place to enable new business on large scale was for the European Commission a very strong argument to approve the HERMES proposal. The technology that will be used for chip embedding uses the top level of HDI printed circuit board (PCB) technology combined with a novel ultra fine technology and a modified component assembly process. The combination of these technologies enables a breakthrough approach for new IC packages and complex high density modules for new 3D applications.

The HERMES consortium

(*) External support of HERMES

For more information on the HERMES project please visit the project website www.hermes-ect.net .