Fairs and exhibitions in 2011

CF will show its newly developed copper foils for finest pitch applications, for low loss CCL as well as for chip embedding techniques :

-          at CPCA in Shanghai from March 15 till March 17 (booth 5A57, hall 5),

-          at IPC in Las Vegas from April 10 till April 14 (booth 374),

-          at KPCA in Seoul from April 19 till April 21 (booths H306 & 308).