Product Sheet: TZA

Datasheet:
Download TZA.pdf -
Foil type:
Matte Side Treated

  • Matte side treated foil
  • High temperature elongation properties
  • For halogen free resin systems
  • Zinc-free, arsenic-free, pink treatment
  • Organic free, anti-tarnish passivation

Product Sheet: TW-YE

Datasheet:
Download TW-YE.pdf -
Foil type:
Matte Side Treated

  • Matte side treated
  • High temperature elongation properties
  • To compensate CTE mismatch in z-expansion
  • No foil cracking during soldering
  • Tight ductility range
  • Upper limit controlled HTE values
  • Exists also in a reverse treated version ( TW-B )
  • Organic free, anti-tarnish passivation

Product Sheet: TWS

Datasheet:
Download TWS.pdf -
Foil type:
Matte Side Treated

  • Matte side treated and with high temperature elongation properties
  • For a wide range of high TG substrates
  • Used for microwave applications and on various thermoplastic materials
  • Exists also in a reverse treated version ( TWS-B )
  • Organic free, anti-tarnish passivation

Product Sheet: Doublethin™-TW

Datasheet:
Download Doublethintm-TW.pdf -
Foil type:
Matte Side Treated

  • Ultra thin 5µm, 7µm and 9µm foils
  • Much more reliable thickness than by half-etching processes
  • For fine line, high density circuitry
  • Supported on a 35µm or 70µm copper carrier
  • Mechanical behaviour like a 1 oz foil
  • Excellent protection of the functional foil
  • Easy peeling of the carrier foil

Product Sheet: Doublethin™-TZA

Datasheet:
Download Doublethintm-TZA.pdf -
Foil type:
Matte Side Treated

  • Ultra thin 2µm, 3µm and 5µm foils
  • Zinc free and arsenic free treatment
  • Fine pitch treatment for CSP and embedding clip technologies
  • Supported on a 35µm copper carrier
  • Mechanical behaviour like a 1 oz foil
  • Excellent protection of the functional foil
  • Easy peeling of the carrier foil

Product Sheet: Doublethin Coreless™

Datasheet:
Download Doublethin-Corelesstm.pdf -
Foil type:
Matte Side Treated

Product Sheet: BF-TZA-PKG

Datasheet:
Download BF-TZA-PKG.pdf -
Foil type:
Matte Side Treated

Product Sheet: LPT-YE

Datasheet:
Download LPT-YE.pdf -
Foil type:
Matte Side Treated

  • Special foil for smart and antenna cards
  • TAB applications
  • Low profile roughness
  • Fast and precise fine line etching
  • Very suitable topography for wire bonding
  • High tensile and yield strength after thermal treatments
  • Maintains perfect flatness for flip chip applications

Product Sheet: HFZ-LP

Datasheet:
Download HFZ-LP.pdf -
Foil type:
Matte Side Treated

  • Matte side treated and with high temperature elongation properties
  • With a zinc free treatment for superior PIM
  • Designed for PTFE based laminates
  • Exists also in a reverse treated version (HFZ-B)
  • Organic free, anti-tarnish passivation

Product Sheet: TWLS

Datasheet:
Download TWLS.pdf -
Foil type:
Matte Side Treated

Product Sheet: BF-HFZ

Datasheet:
Download BF-HFZ.pdf -
Foil type:
Matte Side Treated

  • Designed for ultra thin laminates or high speed controlled impedance boards
  • Zinc-free treatment for superior PIM
  • Ultra flat ED copper foil extreme fine grain structure
  • Fast and precise etching behaviour
  • High temperature elongation properties
  • Organic-free, anti-tarnish passivation

Product Sheet: BF-HFI-LP2

Datasheet:
Download BF-HFI-LP2.pdf -
Foil type:
Matte Side Treated

  • Ultra flat ED copper foil extreme fine grain structure
  • High temperature elongation  properties
  • Special fine pitch treatments (Rz below 4µm)
  • Fast and precise etching behaviour
  • For ultra thin laminates or high speed controlled  impedance boards
  • Available with zinc-free treatment
  • Very high flexural fatigue for dynamic flex applications
  • Organic free, anti-tarnish passivation

Product Sheet: BF-TZA

Datasheet:
Download BF-TZA.pdf -
Foil type:
Matte Side Treated

  • Ultra flat ED copper foil extreme fine grain structure
  • High temperature elongation properties
  • Special fine pitch treatments (Rz below 4µm)
  • Fast and precise etching behaviour
  • Zinc-free, arsenic-free, pink treatment
  • Isotropic characteristics
  • Very high flexural fatigue for dynamic flex applications
  • Organic free, anti-tarnish passivation

Product Sheet: BF-ANP

Datasheet:
Download BF-ANP.pdf -
Foil type:
Matte Side Treated

Product Sheet: TZA-FX

Datasheet:
Download TZA-FX.pdf -
Foil type:
Matte Side Treated

  • Matte side treated foil
  • High temperature elongation properties
  • For static flex 3-layer FCCL and bend-to-install constructions for semi-flex
  • Zinc-free, arsenic-free, pink treatment
  • Organic free, anti-tarnish passivation

Product Sheet: BF-TZA-FX

Datasheet:
Download BF-TZA-FX.pdf -
Foil type:
Matte Side Treated

Product Sheet: TZA-B

Datasheet:
Download TZA-B.pdf -
Foil type:
Reverse side treated

  • Drum side treated and with high temperature elongation properties
  • Very low profile treatment on the shiny side of the foil (Rz : 4 to 4.5µ)
  • Zinc and arsenic free treatment
  • No specific chemical microtech prior photo-process
  • High innerlaminate bond due to untreated matte side profile
  • Superior compatibility to halogen free, phenolic cured, low and mid-loss resin systems
  • NT Stainproofing

Product Sheet: TZA-B-FX

Datasheet:
Download TZA-B-FX.pdf -
Foil type:
Reverse side treated

Product Sheet: TW-B-YE&TW-B

Datasheet:
Download TW-B-YE_TW-B.pdf -
Foil type:
Reverse side treated

  • Treated on the shiny side
  • High temperature elongation
  • Very low profile treatment on the shiny side of the foil ( Rz : 4 to 4.5 µ )
  • No specific chemical microetch prior photo-process
  • High innerlaminate bond due to untreated matte side profile
  • NT Stainproofing
  • Also available as thicker foils from 105 µ to 210 µ

Product Sheet: TWS-B-YE

Datasheet:
Download TWS-B-YE.pdf -
Foil type:
Reverse side treated

  • Treated on the shiny side
  • High temperature elongation
  • Very low profile treatment on the shiny side of the foil
  • Enhanced bond strengh on high TG and filled systems
  • No specific chemical microetch prior photo-process
  • High innerlaminate bond due to untreated matte side
  • NT Stainproofing

Product Sheet: HFZ-B

Datasheet:
Download HFZ-B.pdf -
Foil type:
Reverse side treated

  • Drum side treated and with high temperature elongation properties
  • With a zinc free treatment for superior PIM
  • Up to 20% less Microstrip Insertion Loss
  • Designed for PTFE based laminates
  • Exists also in a matte side version (HFZ-LP)
  • Organic free, anti-tarnish passivation

Product Sheet: BF-Plainstainproof

Datasheet:
Download BF-PLSP.pdf -
Foil type:
No Treatment

 

  • ultra flat ED copper foil
  • extreme fine grain structure
  • high temperature elongation and superior mechanical properties
  • exceptionally low profile ( Rz < 3µ )
  • very suitable for Li-ion batteries
TZA Download Halogen Free MLB / Innerlayers , Regular MLB / Innerlayers , Thin Core
TW-YE Download Regular MLB / Innerlayers
TWS Download High Tg MLB / Innerlayers
Doublethin™-TW Download High Density PCB
Doublethin™-TZA Download CSP - Embedding
Doublethin Coreless™ Download Coreless
BF-TZA-PKG Download BGA
LPT-YE Download Smart Card / Tape Carrier Substrate
HFZ-LP Download High-Frequency
TWLS Download High Speed - Low Dk
BF-HFZ Download High-Frequency , High Speed - Low Dk
BF-HFI-LP2 Download High Speed - Low Dk
BF-TZA Download High Density PCB , High Speed - Low Dk
BF-ANP Download High Speed - Low Dk
TZA-FX Download Static Flex (3-layers FCCL)
BF-TZA-FX Download Dynamic Flex (2-layers FCCL)
TZA-B Download Halogen Free MLB / Innerlayers , Regular MLB / Innerlayers , Thin Core , High Speed - Low Dk
TZA-B-FX Download Static Flex (3-layers FCCL) , Dynamic Flex (2-layers FCCL)
TW-B-YE&TW-B Download Regular MLB / Innerlayers
TWS-B-YE Download High Tg MLB / Innerlayers
HFZ-B Download High-Frequency
TZA Download Low Profile: 5.1 - 10.2 µm
TW-YE Download Standard Profile: > 10.2 µm , Low Profile: 5.1 - 10.2 µm
TWS Download Standard Profile: > 10.2 µm , Low Profile: 5.1 - 10.2 µm
Doublethin™-TW Download Low Profile: 5.1 - 10.2 µm , Very Low Profile: 2.5 - 5.1 µm
Doublethin™-TZA Download Flat Profile: 1.25 - 2.50 µm
Doublethin Coreless™ Download Low Profile: 5.1 - 10.2 µm
BF-TZA-PKG Download Flat Profile: 1.25 - 2.50 µm
LPT-YE Download Low Profile: 5.1 - 10.2 µm , Very Low Profile: 2.5 - 5.1 µm
HFZ-LP Download Low Profile: 5.1 - 10.2 µm
TWLS Download Low Profile: 5.1 - 10.2 µm , Very Low Profile: 2.5 - 5.1 µm
BF-HFZ Download Flat Profile: 1.25 - 2.50 µm
BF-HFI-LP2 Download Flat Profile: 1.25 - 2.50 µm
BF-TZA Download Flat Profile: 1.25 - 2.50 µm
BF-ANP Download Almost No Profile: < 1.25 µm
TZA-FX Download Low Profile: 5.1 - 10.2 µm
BF-TZA-FX Download Flat Profile: 1.25 - 2.50 µm
TZA-B Download Very Low Profile: 2.5 - 5.1 µm
TZA-B-FX Download Very Low Profile: 2.5 - 5.1 µm
TW-B-YE&TW-B Download Very Low Profile: 2.5 - 5.1 µm
TWS-B-YE Download Low Profile: 5.1 - 10.2 µm
HFZ-B Download Very Low Profile: 2.5 - 5.1 µm
BF-Plainstainproof Download Flat Profile: 1.25 - 2.50 µm , Almost No Profile: < 1.25 µm